Раздел 2 Третье занятие

119

stances it is not enough just to commission new-generation tech­nology installations. Special space vehicles will also be needed. Re­search has shown that the acceleration rate on board these vehicles must be reduced to the minimum. Power plants of the capacity of dozens of kw, and later, of hundreds of kw are needed.

Текст 2.5 С

Прочитайте текст и укажите факторы, влияющие на качество резиста. Выполня­ется устно. Значение выделенных слов вы сможете понять из контекста.

Photoresists

Photoresists are high-sensitive materials used to generate etched patterns in substrates. The quality of the etched images depends upon the success of every step in the process, and the image flaws may be due to resist or nonresist imperfections, or to conditions which un­derline resist performance. Some fundamental factors influencing resist performance include adherence coating thickness, heat treat­ment, and resist response to various energy sources. Let us start with adherence.

A strong bond between photoresist and substrate is essential to minimize dimensions changes during development and undercutting or loss of adherence during etching. The intimate contact between resist and substrate required for strong adhesion can be inhibited by surface impurities or resist components. Zones of weakness can be created by surface contaminants such as dust, oil, absorbed gases (par­ticularly absorbed water), dopant ions, or monolayers of previous resist coatings. Removal of obvious visible impurities such as grease, fingerprints, or dust can give an apparently clean surface, but con­tamination is often insidious (опасный) because it is invisible. Wfeakly adsorbed layers of tobacco smoke, water vapor, vacuum pump va- POrs, or nonstripped resist components may be present, even though difficult to detect. Condensing one’s breath on the surface or placing the wafers on a cold plate can sometimes reveal an adsorbed pattern °ⁿ unetched wafers after resist stripping.

121

29. Сравните несколько материалов, используемых в микроэлектронике: их фи­зические, электрические и другие свойства.

30. Расскажите, что вы знаете о применении керамики. (Используйте материал текста 2.6 С “Ceramic-to-Metal Seals”.)

31. Подготовьте сообщения по следующим темам (время подготовки — 5 минуг, высказывания — 1—2 минуты):

1. Intrinsic semiconductor properties.

2. Silicon and its dominant role as a material for microelectronic circuits.

3. New materials and their potentials.

29. Докажите правильность или ошибочность следующих суждений:

1. The silicon dioxide is particularly important in the fabrication of

integrated circuits.

2. Oxygen influences many silicon wafer properties.

Основной текст: Problems in Microelectronic Circuit Technology.

Грамматические явления'. Типы сказуемого. Способы их выявления

в тексте и их перевод.

Лексические явления: Контекстуальное значение слов due, appear,

advance.

Перевод слов с префиксами: in-, out-, en-, inter-.

ПЕРВОЕ ЗАНЯТИЕ

Работа в аудитории

1. Проверьте, знаете ли вы следующие слова.

Слова, имеющие одинаковый корень с русскими словами:

ordinary а generate v position п sandwich v

process n voltage n block v emitter n

insulator n regular a trivalent a collector n

serve v mobile a mask n variety n

manufacture n specification n associate v attack v technique n

Слова исходного уровня и из предшествующих разделов

perform v consider v bind (bound) v available a band n

excess n intrinsic a requirements n impose v delay n

involve v improve v create v state n expose v

reach v sequence n realise v contribute v flexible a