Раздел 1 Третье занятие

85

sired value of resistance. If high precision is required, laser-trimming is used. If high values are desired, the line can be laid down in a zigzag pattern. To form a capacitance one can lay down a thin film of insu­lating material between two thin films of metal.

7. Контроль умения слушать и говорить.

15. Ответьте развернуто на следующие вопросы:

1. What were the most important facts for the development of elec­tronics? microelectronics?

2. Why could not early transistors satisfy the needs of the growing high­speed computers industry and microwave communication systems?

3. What is the major difference between electronic systems and mi­croelectronic devices?

15. Изложите кратко содержание основного текста на ашлиискоч языке. Ос­новная тема сообщения: “Electronics Began with the Development of the Transistor”. Используйте следующие клише:

1. The author examines ...

2. The evolution of (integrated circuits) must begin with the devel­opment of...;

3. In the broad sense (an integrated circuit) is a combination of...;

4. As (chip density) increases ...;

5. The (circuit density) begins ...;

6. Details are given of...;

7. In summary, (the integrated circuit) offers ...

1*23. Подтвердите или опровергните прогнозы о развитии электроники, высказан­ные специалистами в 70-е годы. Используйте следующие выражения:

/. As far as I know. 5. Intensive efforts have been devoted to .

2. To my knowledge.. 6. The efforts continue m the direction of...

3. For all I know... 7. It appears that the (process) will...

4. To sum up...

1- Further developments in thick and thin circuits will extend the range of values achievable using deposition and evaporation tech­niques, although some applications may still require “pellet” type components.

Микроэлектроника настоящее и буду

2. Hybrid microwave devices will decrease in importance as true microwave integrated circuits become more economical.

3. The use of an electron beam instead of a light beam in the photo­graphic process will result in integrated circuits with vastly in~ creased numbers of functions per chip.

4. Materials other than silicon will be used, and other phenomena and structures besidesjunction barriers formed byp and n impuri­ties can be considered.

3

1.24. 1. Дайте определение типов интегральных схем.

2. Обсудите проблемы использования полупроводников.

3. Обсудите преимущества микроэлектроники.

4. Расскажите об электронных компонентах, используя структурно-логичес­кую схему:

transistors, diodes, optoelectronic elements, power transistors, rectifiers

discrete semiconductor deviccs

Микроэлектроника настоящее и будущее

1. Учитесь переводить.

   1. Ознакомьтесь с типами правого определения существительного и переведите их (выполняется устно).

Л"... + Ved... + V¹

1. The state of art influenced by the development was ...

2. The prediction followed by the change of the pattern can help ...

3. The event faced by the designers was ...

4. The wire joined completes ...

N¹... + Ved... +prp + V¹

1. The capability relied upon is reached ...

2. The technique referred to in the paper responds ...

3. The benefit called for can be achieved ...

4. The array thought of points out that...

N¹ + Vto pass + V¹

1. The concept to be referred to evolves ...

2. The point to be reached exceeds...

3. The mode to be considered stems from ...

4. The reliability to be achieved reaches ...

N¹ +Adj + enough + Vto + V¹

1. The impetus strong enough to give rise to the development is ...

2. The shift large enough to be considered was ...

3. The vehicle heavy enough to handle the load is ...

4. The shrink small enough not to be considered was ...

Num + (N) + Adj + V¹

1. The shrink 5 cm long is marked ...

2. The unit 4 m high was used for ...

3. The film 1 mm thick is used ...

N¹ + Adj (типа available) + V¹

1. Improvement available is ...

2. Performance necessary can ...

3. Chip area present is ...

4. Technology similar to the previous one is...

5. The shift possible is used ...