Добавил:

Upload Опубликованный материал нарушает ваши авторские права? Сообщите нам.

Вуз:

Казахский национальный университет им. аль-Фараби

Предмет:

[НЕСОРТИРОВАННОЕ]

Файл:

doc2535.pdf

Скачиваний:

Добавлен:

24.03.2015

Размер:

3.03 Mб

Скачать

☆

<<< < Предыдущая 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 7071 / 7471 72 73 74 > Следующая >>>

22. Ordering Information

Speed (MHz) (3)	Power Supply (V)	Ordering Code (4)	Package (2)	Operation Range
		ATtiny13V-10PU	8P3
		ATtiny13V-10SU	8S2
		ATtiny13V-10SUR	8S2
10	1.8 - 5.5	ATtiny13V-10SSU	S8S1	Industrial
		ATtiny13V-10SSUR	S8S1	Industrial
		ATtiny13V-10SSUR	S8S1	(-40°C to +85°C)(1)
		ATtiny13V-10MU	20M1	(-40°C to +85°C)(1)
		ATtiny13V-10MU	20M1
		ATtiny13V-10MUR	20M1
		ATtiny13V-10MMU	10M1
		ATtiny13V-10MMUR	10M1

		ATtiny13-20PU	8P3
		ATtiny13-20SU	8S2
		ATtiny13-20SUR	8S2
		ATtiny13-20SSU	S8S1	Industrial
20	2.7 - 5.5	ATtiny13-20SSUR	S8S1	Industrial
20	2.7 - 5.5	ATtiny13-20SSUR	S8S1	(-40°C to +85°C)(1)
		ATtiny13-20MU	20M1	(-40°C to +85°C)(1)
		ATtiny13-20MU	20M1
		ATtiny13-20MUR	20M1
		ATtiny13-20MMU	10M1
		ATtiny13-20MMUR	10M1

Notes: 1. These devices can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information and minimum quantities.

2.All packages are Pb-free, halide-free and fully green and they comply with the European directive for Restriction of Hazardous Substances (RoHS).

3.For Speed vs. VCC, see “Speed Grades” on page 117.

4.Code indicators:

–U: matte tin

–R: tape & reel

	Package Type
8P3	8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S2	8-lead, 0.209" Wide, Plastic Small Outline Package (EIAJ SOIC)

S8S1	8-lead, 0.150" Wide, Plastic Gull-Wing Small Outline (JEDEC SOIC)

20M1	20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm, Micro Lead Frame Package (MLF)

10M1	10-pad, 3 x 3 x 1 mm Body, Lead Pitch 0.50 mm, Micro Lead Frame Package (MLF)

160 ATtiny13

2535J–AVR–08/10

ATtiny13

23. Packaging Information

23.18P3

1	E






					N
					N
		Top View							c




												eA
												eA

										End View
													COMMON DIMENSIONS
			D										COMMON DIMENSIONS
													(Unit of Measure = inches)

				e
D1							A2 A				SYMBOL			MIN	NOM	MAX	NOTE



											A					0.210	2
											A					0.210	2

											A2		0.115		0.130	0.195
											A2		0.115		0.130	0.195
											b		0.014		0.018	0.022	5
											b2		0.045		0.060	0.070	6
											b2		0.045		0.060	0.070	6

											b3		0.030		0.039	0.045	6
											b3		0.030		0.039	0.045	6

											c		0.008		0.010	0.014
											D		0.355		0.365	0.400	3
						b2		L
b3											D1		0.005				3
											D1		0.005				3

					b						E		0.300		0.310	0.325	4
											E		0.300		0.310	0.325	4
4 PLCS
4 PLCS											E1		0.240		0.250	0.280	3
											E1		0.240		0.250	0.280	3

	Side View										e				0.100 BSC

											eA				0.300 BSC		4
											eA				0.300 BSC		4
											L		0.115		0.130	0.150	2

Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.

2.Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.

3.D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.

4.E and eA measured with the leads constrained to be perpendicular to datum.

5.Pointed or rounded lead tips are preferred to ease insertion.

6.b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).

01/09/02

	TITLE	DRAWING NO.	REV.
2325 Orchard Parkway	8P3, 8-lead, 0.300" Wide Body, Plastic Dual	8P3	B
R San Jose, CA 95131	In-line Package (PDIP)

161

2535J–AVR–08/10

23.28S2

E



							E1

	L
N
TOP VIEW	θ
	END VIEW

e	b		COMMON DIMENSIONS
	b

	A		(Unit of Measure = mm)
		SYMBOL	MIN	NOM	MAX	NOTE
	A1	A	1.70		2.16
		A	1.70		2.16
		A1	0.05		0.25
		b	0.35		0.48	4
		C	0.15		0.35	4
	D	D	5.13		5.35
	D	E1	5.18		5.40	2
		E1	5.18		5.40	2

	E	7.70		8.26
SIDE VIEW	L	0.51		0.85

	θ	0°		8°
	θ	0°		8°
	e		1.27 BSC	3

Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.

2.Mismatch of the upper and lower dies and resin burrs aren't included.

3.Determines the true geometric position.

4.Values b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm.

4/15/08

	TITLE	GPC	DRAWING NO.	REV.
Package Drawing Contact:	8S2, 8-lead, 0.208” Body, Plastic Small	STN	8S2	F
packagedrawings@atmel.com	Outline Package (EIAJ)
packagedrawings@atmel.com	Outline Package (EIAJ)

162 ATtiny13

2535J–AVR–08/10

23.3S8S1

3	2	1

	N
Top View
e	B
	A
D
Side View

End View

ATtiny13

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL	MIN	NOM	MAX	NOTE
A	–	–	1.75

B	–	–	0.51

C	–	–	0.25

D	–	–	5.00

E	–	–	4.00

e		1.27 BSC

H	–	–	6.20

L	–	–	1.27

Note: This drawing is for general information only. Refer to JEDEC Drawing MS-012 for proper dimensions, tolerances, datums, etc.

10/10/01

		TITLE	DRAWING NO.	REV.
	2325 Orchard Parkway	8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing	8S1	A
R	San Jose, CA 95131	Small Outline (JEDEC SOIC)
R	San Jose, CA 95131	Small Outline (JEDEC SOIC)

163

2535J–AVR–08/10

23.420M1

Pin 1 ID

3		E
3

TOP VIEW

	1
Pin #1	2
Notch	3	E2
(0.20 R)	3	E2

BOTTOM VIEW

Note: Reference JEDEC Standard MO-220, Fig. 1 (SAW Singulation) WGGD-5.

SIDE VIEW

0.08 C

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL	MIN	NOM	MAX	NOTE
A	0.70	0.75	0.80

A1	–	0.01	0.05

A2		0.20 REF

b	0.18	0.23	0.30

D		4.00 BSC

D2	2.45	2.60	2.75

E		4.00 BSC

E2	2.45	2.60	2.75

e		0.50 BSC

L	0.35	0.40	0.55

10/27/04

	TITLE	DRAWING NO.	REV.
2325 Orchard Parkway	20M1, 20-pad, 4 x 4 x 0.8 mm Body, Lead Pitch 0.50 mm,	20M1	A
R San Jose, CA 95131	2.6 mm Exposed Pad, Micro Lead Frame Package (MLF)	20M1	A

164 ATtiny13

2535J–AVR–08/10

ATtiny13

23.510M1

Pin 1 ID

TOP VIEW

E1					b
E1					b

L	BOTTOM VIEW

SIDE VIEW

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL	MIN	NOM	MAX	NOTE
A	0.80	0.90	1.00

A1	0.00	0.02	0.05

b	0.18	0.25	0.30

D	2.90	3.00	3.10

D1	1.40	–	1.75

E	2.90	3.00	3.10

E1	2.20	–	2.70

e		0.50

L	0.30	–	0.50

y	–	–	0.08

K	0.20	–	–

Notes: 1. This package conforms to JEDEC reference MO-229C, Variation VEED-5.

2. The terminal #1 ID is a Lasser-marked Feature.

7/7/06

	TITLE		DRAWING NO.	REV.
2325 Orchard Parkway	10M1, 10-pad, 3 x 3 x 1.0 mm Body, Lead Pitch 0.50 mm,		10M1	A
R San Jose, CA 95131	1.64 x	2.60 mm Exposed Pad, Micro Lead Frame Package	10M1	A

165

2535J–AVR–08/10

<<< < Предыдущая 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 7071 / 7471 72 73 74 > Следующая >>>

Соседние файлы в предмете [НЕСОРТИРОВАННОЕ]

#
24.03.2015123.16 Кб23diplom7.docx
#
24.03.20151.95 Mб134diplomkaNEGIZGI.docx
#
24.03.2015138.24 Кб23diplom_kz_2012.doc
#
08.03.20161.51 Mб11DLFE-42802.pdf
#
24.03.2015688.02 Кб34Dlya_tebya_Mara (1).docx
#
24.03.20153.03 Mб49doc2535.pdf
#
24.03.201545.91 Кб18Dokument_Microsoft_Office_Word.docx
#
17.09.201936.21 Кб5Dokument_Microsoft_Office_Word_2.docx
#
28.09.2019156.22 Кб5Dokument_Microsoft_Word_PROGA.docx
#
11.12.2018535.55 Кб61Dolgina_kratkaja.doc
#
16.11.201896.77 Кб7Domestic violence.doc